Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two-component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock.
Source article: https://mfgaxis.com/press-releases/ep21tdcn-lo-electrically-conductive-adhesive-sealant/
Company: Master Bond
Press Release: EP21TDCN-LO Electrically Conductive Adhesive/Sealant
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