Electro Scientific Industries Inc. announced the availability of its Geode laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB). This new entry combines a CO2 laser and advanced beam control capabilities to deliver industry-leading throughput and accuracy from a system that is significantly smaller and lighter than current competitive offerings.
Source article: https://mfgaxis.com/press-releases/geode-laser-based-micro-via-drilling-system/
Company: Electro Scientific Industries Inc.
Press Release: Geode Laser-Based Micro-via Drilling System
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