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Press Release: Three-dimensional Molded Interconnect Devices

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Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.
Source article: https://mfgaxis.com/press-releases/three-dimensional-molded-interconnect-devices/
Company: Multiple Dimension AG

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